IPC-2221 / IPC-2152 Compliant
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1A Trace Width Calculator

1oz Copper | Internal Layer | IPC-2221

Calculated Result

For 1A current on 1oz copper internal layer with 10°C temperature rise:

0.79mm/30.9mil

Input Parameters

MOD: TR_WID_V1
A
°C
oz
Layer Type
Units / Trace Length
Calculated Output

Results

VerificationIPC-2221 Valid
Critical Dimension
---mm
Trace Resistance
0.0000Ω
Voltage Drop
0.0000V
Power Loss
0.0000W
Technical Plan View (Scale: Schematic Only)W:0.000mmL:10mm
Cross-Section ProfileFR-4 Dielectric

Understanding 1A Trace Width Requirements

When designing a PCB that needs to carry 1 amperes of current, proper trace width calculation is critical for thermal management and reliability. Based on the IPC-2221 standard, a 1oz copper internal layer trace requires approximately 0.79mm (30.9 mil) width to safely handle this current with a 10°C temperature rise. This calculation ensures your printed circuit board maintains optimal performance without excessive heating, which could lead to solder joint failure, delamination, or fire hazards in extreme cases.

Key Parameters for 1A Design

  • Current Capacity: 1A (amperes) - the maximum continuous current this trace is designed to carry
  • Copper Weight: 1 oz/ft² (35μm) - determines the conductor cross-sectional area
  • Layer Type: Internal ( sandwiched between FR4 dielectric material)
  • Temperature Rise: 10°C above ambient (IPC-2221 conservative design guideline)
  • Cross-Section Area: 42.39 sq mil (0.0274 mm²)

Why Layer Type Matters for 1A Current

Internal layers are sandwiched between FR4 dielectric material, which has relatively poor thermal conductivity (~0.3 W/m·K). For 1A on 1oz copper internal layer, the trace must be wider to compensate for reduced heat dissipation. The calculated width of 0.79mm ensures safe operation even with limited thermal pathways.

IPC-2221 Standard Formula

The IPC-2221B standard provides the industry-accepted formula for PCB trace width calculation: I = k × ΔT^b × A^c, where I is current in amperes, ΔT is temperature rise in °C, A is cross-sectional area in square mils, and k, b, c are empirical constants specific to internal layers. This formula has been validated through extensive testing and is used by PCB designers worldwide for 1A and higher current applications.

Typical Applications for 1A Traces

Signal traces and low-power control circuits
LED driver circuits and indicator LEDs
Sensor power supply connections
Microcontroller I/O and peripheral connections

Frequently Asked Questions

Can I use a narrower trace than 0.79mm for 1A?

Using a narrower trace will increase temperature rise beyond 10°C. While acceptable for some applications, exceeding 20-30°C rise can affect solder joint reliability and nearby component performance. Consider using thicker copper (e.g., 2oz) or parallel traces for high-reliability designs.

How does ambient temperature affect this calculation?

The IPC-2221 formula calculates temperature RISE above ambient. If your board operates in a 50°C environment with 10°C rise, the trace will reach 60°C. For high-ambient applications, design for lower temperature rise to maintain adequate safety margins.

Should I add thermal vias for 1A traces?

Thermal vias can significantly improve heat dissipation, especially for internal layer traces. For 1A and above, consider adding vias connecting to ground planes for additional thermal spreading. Use our via current calculator to properly size thermal vias.

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Complete Your PCB Design

After calculating trace width for 1A, use our other free tools to complete your PCB design. Calculate via current capacity, controlled impedance for high-speed signals, and more.

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