2A Trace Width Calculator
2oz Copper | Internal Layer | IPC-2221
For 2A current on 2oz copper internal layer with 10°C temperature rise:
Input Parameters
MOD: TR_WID_V1Results
Understanding 2A Trace Width Requirements
When designing a PCB that needs to carry 2 amperes of current, proper trace width calculation is critical for thermal management and reliability. Based on the IPC-2221 standard, a 2oz copper internal layer trace requires approximately 1.02mm (40.2 mil) width to safely handle this current with a 10°C temperature rise. This calculation ensures your printed circuit board maintains optimal performance without excessive heating, which could lead to solder joint failure, delamination, or fire hazards in extreme cases.
Key Parameters for 2A Design
- Current Capacity: 2A (amperes) - the maximum continuous current this trace is designed to carry
- Copper Weight: 2 oz/ft² (70μm) - determines the conductor cross-sectional area
- Layer Type: Internal ( sandwiched between FR4 dielectric material)
- Temperature Rise: 10°C above ambient (IPC-2221 conservative design guideline)
- Cross-Section Area: 110.28 sq mil (0.0712 mm²)
Why Layer Type Matters for 2A Current
Internal layers are sandwiched between FR4 dielectric material, which has relatively poor thermal conductivity (~0.3 W/m·K). For 2A on 2oz copper internal layer, the trace must be wider to compensate for reduced heat dissipation. The calculated width of 1.02mm ensures safe operation even with limited thermal pathways.
IPC-2221 Standard Formula
The IPC-2221B standard provides the industry-accepted formula for PCB trace width calculation: I = k × ΔT^b × A^c, where I is current in amperes, ΔT is temperature rise in °C, A is cross-sectional area in square mils, and k, b, c are empirical constants specific to internal layers. This formula has been validated through extensive testing and is used by PCB designers worldwide for 2A and higher current applications.
Typical Applications for 2A Traces
Frequently Asked Questions
Can I use a narrower trace than 1.02mm for 2A?
Using a narrower trace will increase temperature rise beyond 10°C. While acceptable for some applications, exceeding 20-30°C rise can affect solder joint reliability and nearby component performance. Consider using thicker copper (e.g., 2oz) or parallel traces for high-reliability designs.
How does ambient temperature affect this calculation?
The IPC-2221 formula calculates temperature RISE above ambient. If your board operates in a 50°C environment with 10°C rise, the trace will reach 60°C. For high-ambient applications, design for lower temperature rise to maintain adequate safety margins.
Should I add thermal vias for 2A traces?
Thermal vias can significantly improve heat dissipation, especially for internal layer traces. For 2A and above, consider adding vias connecting to ground planes for additional thermal spreading. Use our via current calculator to properly size thermal vias.
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