IPC-2221 / IPC-2152 Compliant
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30A Trace Width Calculator

2oz Copper | Internal Layer | IPC-2221

Calculated Result

For 30A current on 2oz copper internal layer with 10°C temperature rise:

42.83mm/1,686.4mil

Input Parameters

MOD: TR_WID_V1
A
°C
oz
Layer Type
Units / Trace Length
Calculated Output

Results

VerificationIPC-2221 Valid
Critical Dimension
---mm
Trace Resistance
0.0000Ω
Voltage Drop
0.0000V
Power Loss
0.0000W
Technical Plan View (Scale: Schematic Only)W:0.000mmL:10mm
Cross-Section ProfileFR-4 Dielectric

Understanding 30A Trace Width Requirements

When designing a PCB that needs to carry 30 amperes of current, proper trace width calculation is critical for thermal management and reliability. Based on the IPC-2221 standard, a 2oz copper internal layer trace requires approximately 42.83mm (1,686.4 mil) width to safely handle this current with a 10°C temperature rise. This calculation ensures your printed circuit board maintains optimal performance without excessive heating, which could lead to solder joint failure, delamination, or fire hazards in extreme cases.

Key Parameters for 30A Design

  • Current Capacity: 30A (amperes) - the maximum continuous current this trace is designed to carry
  • Copper Weight: 2 oz/ft² (70μm) - determines the conductor cross-sectional area
  • Layer Type: Internal ( sandwiched between FR4 dielectric material)
  • Temperature Rise: 10°C above ambient (IPC-2221 conservative design guideline)
  • Cross-Section Area: 4,620.65 sq mil (2.9811 mm²)

Why Layer Type Matters for 30A Current

Internal layers are sandwiched between FR4 dielectric material, which has relatively poor thermal conductivity (~0.3 W/m·K). For 30A on 2oz copper internal layer, the trace must be wider to compensate for reduced heat dissipation. The calculated width of 42.83mm ensures safe operation even with limited thermal pathways.

IPC-2221 Standard Formula

The IPC-2221B standard provides the industry-accepted formula for PCB trace width calculation: I = k × ΔT^b × A^c, where I is current in amperes, ΔT is temperature rise in °C, A is cross-sectional area in square mils, and k, b, c are empirical constants specific to internal layers. This formula has been validated through extensive testing and is used by PCB designers worldwide for 30A and higher current applications.

Typical Applications for 30A Traces

High-power motor controllers and ESCs
Power inverter main bus bars
EV battery management systems (BMS)
Industrial power supply output stages

Frequently Asked Questions

Can I use a narrower trace than 42.83mm for 30A?

Using a narrower trace will increase temperature rise beyond 10°C. While acceptable for some applications, exceeding 20-30°C rise can affect solder joint reliability and nearby component performance. Consider using thicker copper (e.g., 2oz) or parallel traces for high-reliability designs.

How does ambient temperature affect this calculation?

The IPC-2221 formula calculates temperature RISE above ambient. If your board operates in a 50°C environment with 10°C rise, the trace will reach 60°C. For high-ambient applications, design for lower temperature rise to maintain adequate safety margins.

Should I add thermal vias for 30A traces?

Thermal vias can significantly improve heat dissipation, especially for internal layer traces. For 30A and above, consider adding vias connecting to ground planes for additional thermal spreading. Use our via current calculator to properly size thermal vias.

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Complete Your PCB Design

After calculating trace width for 30A, use our other free tools to complete your PCB design. Calculate via current capacity, controlled impedance for high-speed signals, and more.

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