0.4mm Via Current Calculator
Single Via | Large Via | IPC-2221
For 0.4mm (16 mil) via with 25µm plating and 1 via(s):
(2.31A per via)
Via Parameters
MOD: VIA_CUR_V1Capacity Check
1 vias × --- A each
Understanding 0.4mm Via Current Capacity
A 0.4mm (16 mil) plated through hole (PTH) via with standard 25µm copper plating can carry approximately 2.31A per via based on the IPC-2221 standard. When using 1 parallel via(s), the total current capacity increases to 2.31A, making this configuration suitable for moderate power delivery.
Key Parameters for 0.4mm Via
- Hole Diameter: 0.4mm (16 mil) - large via category
- Plating Thickness: 25µm (standard electroplated copper)
- Board Thickness: 1.6mm (via barrel length)
- Temperature Rise: 10°C (IPC-2221 conservative guideline)
- Cross-Section Area: 33,379 µm² per via
- Resistance: 0.843 mΩ per via
Why Use 1 Parallel Via(s)?
A single 0.4mm via provides 2.31A capacity, suitable for signal routing or low-power connections. Single vias minimize PCB real estate usage but limit current capacity. For applications requiring more than 2.31A, consider using multiple parallel vias.
IPC-2221 Via Current Formula
The IPC-2221 standard calculates via current capacity using the copper annulus cross-sectional area (the ring of copper plating on the via barrel wall). The formula I = k × ΔT^b × A^c determines the current capacity based on the copper area and allowable temperature rise. For a 0.4mm via with 25µm plating, the effective copper area is 33,379 µm², yielding 2.31A capacity per via.
Typical Applications for 0.4mm Via with 2.31A Capacity
Frequently Asked Questions
Can I use fewer than 1 via(s) for 2.31A?
Reducing the number of vias will increase the temperature rise beyond 10°C for the same current. This may be acceptable for some applications, but exceeding 20-30°C rise can affect solder joint reliability and nearby component performance.
Should I use filled or hollow vias for 0.4mm?
For large vias like 0.4mm, hollow vias with multiple parallel vias (as shown here with 1 vias) are typically more cost-effective than filled vias. Filled vias provide better thermal performance but at higher manufacturing cost.
What spacing should I use between 1 parallel vias?
For 0.4mm vias, a center-to-center spacing of 1.00mm to 1.20mm is recommended. This allows adequate copper pad annular ring and ensures proper current distribution while maintaining manufacturing yield.
Related Via Current Calculations
Complete Your PCB Design
After calculating via current for 0.4mm with 1 via(s), use our other free tools to complete your PCB design. Calculate trace widths for power traces, or analyze impedance for high-speed signals.