0.5mm Via Current Calculator
2 Vias | Power Via | IPC-2221
For 0.5mm (20 mil) via with 25µm plating and 2 via(s):
(2.69A per via)
Via Parameters
MOD: VIA_CUR_V1Capacity Check
1 vias × --- A each
Understanding 0.5mm Via Current Capacity
A 0.5mm (20 mil) plated through hole (PTH) via with standard 25µm copper plating can carry approximately 2.69A per via based on the IPC-2221 standard. When using 2 parallel via(s), the total current capacity increases to 5.39A, making this configuration suitable for high-current power applications.
Key Parameters for 0.5mm Via
- Hole Diameter: 0.5mm (20 mil) - power via category
- Plating Thickness: 25µm (standard electroplated copper)
- Board Thickness: 1.6mm (via barrel length)
- Temperature Rise: 10°C (IPC-2221 conservative guideline)
- Cross-Section Area: 41,233 µm² per via
- Resistance: 0.682 mΩ per via
Why Use 2 Parallel Via(s)?
Using 2 parallel 0.5mm vias divides the total current load, reducing thermal stress on each individual via and providing redundancy. With 2 vias, the total resistance drops to 0.341 mΩ (compared to 0.682 mΩ for a single via), resulting in lower voltage drop of 1.84 mV at maximum load.
IPC-2221 Via Current Formula
The IPC-2221 standard calculates via current capacity using the copper annulus cross-sectional area (the ring of copper plating on the via barrel wall). The formula I = k × ΔT^b × A^c determines the current capacity based on the copper area and allowable temperature rise. For a 0.5mm via with 25µm plating, the effective copper area is 41,233 µm², yielding 2.69A capacity per via.
Typical Applications for 0.5mm Via with 5.39A Capacity
Frequently Asked Questions
Can I use fewer than 2 via(s) for 5.39A?
Reducing the number of vias will increase the temperature rise beyond 10°C for the same current. This may be acceptable for some applications, but exceeding 20-30°C rise can affect solder joint reliability and nearby component performance.
Should I use filled or hollow vias for 0.5mm?
For power vias like 0.5mm, hollow vias with multiple parallel vias (as shown here with 2 vias) are typically more cost-effective than filled vias. Filled vias provide better thermal performance but at higher manufacturing cost.
What spacing should I use between 2 parallel vias?
For 0.5mm vias, a center-to-center spacing of 1.25mm to 1.50mm is recommended. This allows adequate copper pad annular ring and ensures proper current distribution while maintaining manufacturing yield.
Related Via Current Calculations
Complete Your PCB Design
After calculating via current for 0.5mm with 2 via(s), use our other free tools to complete your PCB design. Calculate trace widths for power traces, or analyze impedance for high-speed signals.