IPC-2221 / IPC-2152 Compliant
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Best Practices2024-12-0413 min read

PCB Design Checklist: 25 Key Points

You've finished your PCB design and you're ready to hit the "order" button. Stop. Before you commit to manufacturing, run through this checklist. It's far cheaper to catch mistakes now than after you've received 100 boards with the same error.

This comprehensive checklist covers everything from basic connectivity to advanced manufacturing requirements. Print it out. Tape it to your monitor. Your future self will thank you.

Part 1: Schematic Verification

1All nets are named (no default NET###)High
2Power pins connected to correct railsCritical
3Decoupling caps present for all ICsHigh
4Pull-up/pull-down resistors verifiedMedium
5Crystal/oscillator load caps correctHigh
6Reset circuitry present and correctHigh
7ESD protection on external interfacesMedium

Part 2: Power Integrity

8Trace widths calculated for current capacityCritical
9Voltage drop acceptable on power tracesHigh
10Via count sufficient for power transitionsHigh
11Ground plane continuity verifiedCritical
12Return current paths consideredHigh
13Thermal relief on power pads appropriateMedium

Use our Trace Width Calculator and Via Current Calculator to verify items 8-10.

Part 3: Signal Integrity

14Impedance-controlled traces identifiedHigh
15Differential pairs routed correctlyHigh
16Length matching within toleranceHigh
17No traces crossing split planesCritical
18Ground vias near signal viasMedium
19No 90° angles on high-speed tracesMedium

For impedance requirements, see our High-Speed Impedance Guide.

Part 4: Thermal Management

20Thermal vias under hot componentsHigh
21Adequate copper pour for heat spreadingMedium
22Component spacing allows airflowMedium

For thermal via guidance, see our Thermal Via vs Signal Via Guide.

Part 5: Design for Manufacturing (DFM)

23Minimum trace/space within fab capabilityCritical
24Minimum hole size within fab capabilityCritical
25Annular ring adequate for via sizesHigh
Typical DFM Limits
ParameterStandardAdvanced
Min trace width5 mil3 mil
Min trace space5 mil3 mil
Min hole size10 mil6 mil
Min annular ring4 mil3 mil
Via-to-trace clearance6 mil4 mil

Part 6: Design for Assembly (DFA)

26Component orientation consistentMedium
27Fiducials present (for SMT assembly)High
28Component spacing meets assembly rulesHigh
29Solder mask between fine-pitch padsHigh
30No components under connectors/headersMedium

Part 7: Silkscreen & Documentation

31Reference designators visibleMedium
32Polarity markers on polarized componentsHigh
33Pin 1 indicators on ICsHigh
34Board revision/date presentLow
35Test points labeledLow

Part 8: Final Checks Before Order

36DRC errors: ZEROCritical
37ERC errors: ZERO (or understood)Critical
38Gerber files visually inspectedHigh
39Drill file verifiedHigh
40Stackup matches fab capabilityHigh
41BOM matches schematicCritical
42Pick and place file generatedMedium

CRITICAL: Never proceed with DRC or ERC errors. "It'll probably be fine" is the most expensive phrase in hardware engineering. Fix all errors or document exactly why each one is acceptable.

Checklist Summary

Checklist Items by Category
CategoryItemsCritical
Schematic71
Power Integrity62
Signal Integrity61
Thermal30
DFM32
DFA50
Silkscreen50
Final Checks73
TOTAL429

Use This Checklist

Copy this page URL and reference it before every board order. Better yet, create your own version in your project documentation with additional items specific to your design requirements.

The most expensive bug is the one you could have caught with a checklist.

Pro tip: Consider using AI assistants to help review your design documentation. Tools like Gemini prompt generators can help you craft effective queries to double-check your design decisions with AI-powered analysis.

Related Reading

Tags
ChecklistManufacturingDFMQuality Control

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