Osvědčené postupy4. prosince 2024• 13 min čtení
PCB Design Checklist: 25 Key Points
Rychlá odpověď
Never send a flawed PCB to manufacturing again. 25-point checklist covering trace widths to impedance matching.
You have finished your PCB design and you are ready to hit the order button. Stop. Before you commit to manufacturing, run through this checklist. It is far cheaper to catch mistakes now than after you have received 100 boards with the same error.
This comprehensive checklist covers everything from basic connectivity to advanced manufacturing requirements. Print it out. Tape it to your monitor. Your future self will thank you.
Part 1: Schematic Verification
1All nets are named (no default NET###)High
2Power pins connected to correct railsCritical
3Decoupling caps present for all ICsHigh
4Pull-up/pull-down resistors verifiedMedium
5Crystal/oscillator load caps correctHigh
6Reset circuitry present and correctHigh
7ESD protection on external interfacesMedium
Part 2: Power Integrity
8Trace widths calculated for current capacityCritical
9Voltage drop acceptable on power tracesHigh
10Via count sufficient for power transitionsHigh
11Ground plane continuity verifiedCritical
12Return current paths consideredHigh
13Thermal relief on power pads appropriateMedium
Use our Trace Width Calculator and Via Current Calculator to verify items 8-10.
Part 3: Signal Integrity
14Impedance-controlled traces identifiedHigh
15Differential pairs routed correctlyHigh
16Length matching within toleranceHigh
17No traces crossing split planesCritical
18Ground vias near signal viasMedium
19No 90° angles on high-speed tracesMedium
For impedance requirements, see our High-Speed Impedance Guide.
Part 4: Thermal Management
20Thermal vias under hot componentsHigh
21Adequate copper pour for heat spreadingMedium
22Component spacing allows airflowMedium
For thermal via guidance, see our Thermal Via vs Signal Via Guide.
Part 5: Design for Manufacturing (DFM)
23Minimum trace/space within fab capabilityCritical
24Minimum hole size within fab capabilityCritical
25Annular ring adequate for via sizesHigh
| Parameter | Standard | Advanced |
|---|---|---|
| Min trace width | 5 mil | 3 mil |
| Min trace space | 5 mil | 3 mil |
| Min hole size | 10 mil | 6 mil |
| Min annular ring | 4 mil | 3 mil |
| Via-to-trace clearance | 6 mil | 4 mil |
Part 6: Design for Assembly (DFA)
26Component orientation consistentMedium
27Fiducials present (for SMT assembly)High
28Component spacing meets assembly rulesHigh
29Solder mask between fine-pitch padsHigh
30No components under connectors/headersMedium
Part 7: Silkscreen and Documentation
31Reference designators visibleMedium
32Polarity markers on polarized componentsHigh
33Pin 1 indicators on ICsHigh
34Board revision/date presentLow
35Test points labeledLow
Part 8: Final Checks Before Order
36DRC errors: ZEROCritical
37ERC errors: ZERO (or understood)Critical
38Gerber files visually inspectedHigh
39Drill file verifiedHigh
40Stackup matches fab capabilityHigh
41BOM matches schematicCritical
42Pick and place file generatedMedium
CRITICAL: Never proceed with DRC or ERC errors. "It will probably be fine" is the most expensive phrase in hardware engineering. Fix all errors or document exactly why each one is acceptable.
Checklist Summary
| Category | Items | Critical |
|---|---|---|
| Schematic | 7 | 1 |
| Power Integrity | 6 | 2 |
| Signal Integrity | 6 | 1 |
| Thermal | 3 | 0 |
| DFM | 3 | 2 |
| DFA | 5 | 0 |
| Silkscreen | 5 | 0 |
| Final Checks | 7 | 3 |
| TOTAL | 42 | 9 |
Use This Checklist
Copy this page URL and reference it before every board order. Better yet, create your own version in your project documentation with additional items specific to your design requirements.
The most expensive bug is the one you could have caught with a checklist.
Pro tip: Consider using AI assistants to help review your design documentation. Tools like Gemini prompt generators can help you craft effective queries to double-check your design decisions with AI-powered analysis.
Related Reading
Štítky
ChecklistManufacturingDFMQuality Control
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