Manufacturing

Panelization Calculator

Panel Layout • Utilization Optimization

Calculate optimal PCB panel layout for manufacturing. Maximize board count and material utilization with V-score or tab routing options.

Board Dimensions

Board Width (mm)

Board Height (mm)

Panel Dimensions

Panel Width (mm)

Panel Height (mm)

Separation Method

Rail Width (mm)

Use Tab Routing (instead of V-Score)

V-Score Gap (mm)

Panelization Results

Common Panel Sizes

Panel Size	Area	Typical Use
100×100mm	100 cm²	Small prototypes
150×100mm	150 cm²	Prototypes
200×150mm	300 cm²	Small production
250×200mm	500 cm²	Medium production
300×250mm	750 cm²	Large production
457×305mm	1394 cm²	High volume (18"×12")

*Available sizes vary by manufacturer. Check with your PCB supplier for their standard panel sizes.

Board Separation Methods

V-Score (V-Groove)

Shallow V-shaped groove cut into both sides of the PCB, typically 1/3 depth each side:

✓Clean, straight break lines
✓Minimal gap between boards (0.2-0.5mm)
✓Lower cost than routing
!Only for straight lines, full panel width

Tab Routing

Boards connected by small breakaway tabs with routed perforations:

✓Works with irregular board shapes
✓Mouse bites for easy separation
✓Better for fragile components near edges
!Larger gap (2-3mm), rough edge at tabs

Panelization Best Practices

📏

Rail Width

Use 5-10mm rails for SMT assembly. Include fiducial marks and tooling holes in rails for pick-and-place alignment.

🔄

Rotation

Try both orientations - rotating boards 90° can sometimes fit more boards or improve utilization significantly.

⚠️

Keep-Outs

Maintain clearance from V-score lines for components and traces. Typically 0.5-1mm minimum from groove edge.

Panel Utilization Guidelines

>70%

Excellent

Optimal layout, cost-effective production

50-70%

Good

Acceptable for most applications

30-50%

Moderate

Consider different panel size or rotation

<30%

Poor

Significant waste, review board and panel dimensions

Manufacturing Considerations

•Mixed arrays: Different board designs can be combined on one panel if they share the same layer stackup and specifications.
•Assembly rails: For automated assembly, include handling rails with fiducials even if they reduce utilization.
•Test points: Consider adding test coupons or impedance test strips in waste areas of the panel.
•Depaneling stress: Component placement near break lines should account for mechanical stress during separation.